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Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset
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Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset
Syringe Tube Thermal heatsink compounds Grease silicone paste for CPU IC GPU VGA chipset white Gray
Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset 是 1 的可购买的增量
Powered by the most advanced mobile processors from the new Core 2 Duo MacBook Pro is over 50% faster than the original Core Duo MacBook Pro and now supports up to 4GB.
About Me : Powered by the most advanced mobile processors from the new Core 2 Duo MacBook Pro is over 50% faster than the original Core Duo MacBook Pro and now supports up to 4GB.Composition : 100% POLYESTER Example Shown : SIZE XS, Hem to Hem 84cm OR 33 '
The product has been strictly tested
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Syringe Theraml Heatsink compounds
High thermal conductivity and low thermal resistance, with excellent thermal conductivity;
Low viscosity, with certain thixotropy, low oil separation;
Excellent electrical insulation performance and aging resistance;
Good construction performance, suitable for various construction techniques such as screen printing, dispensing and smearing;
Excellent resistance to high and low temperature range performance, can be used in the environment of -55 ℃ ~ 240 ℃.
12.8W Syringe Theraml Heatsink compounds
color: gray
Thermal conductivity W/m·K 12.8
Non-toxic, tasteless, non-corrosive
Thermal resistance (40PSI) ℃·cm2/W <0.03
Density g/cm3 >3.42
Viscosity (25℃) 100Pa·s
Cone penetration 1/10mm 300±10
Volatile matter (200℃)% <0.02
Oil separation degree (200℃)% <0.02
Dielectric strength (AC) Kv/mm ≥6.0
Volume resistivity Ω·cm >1013
Working temperature ℃ -60~250
Net Weight: approx. 1.0g
Accessory ONLY.
5W Syringe Theraml Heatsink compounds
color: gray
Thermal conductivity W/m·K 5
Non-toxic, tasteless, non-corrosive
Thermal resistance (40PSI) ℃·cm2/W <0.055
Density g/cm3 >2.96
Viscosity (25℃) 100Pa·s
Cone penetration 1/10mm 300±10
Volatile matter (200℃)% <0.08
Oil separation degree (200℃)% <0.05
Dielectric strength (AC) Kv/mm ≥6.0
Volume resistivity Ω·cm >1013
Working temperature ℃ -55~240
Net Weight: approx. 1.0g
Accessory ONLY.
RoHS ---- Compliant More Chipset Tool products, click here . Need More this item or out of stock, please contact us .
更多信息
产品品牌
OSGEAR
Product Type
heatsink compounds paste
型号
HEATSKPST-ALL
货物状况
全新品
UPC
768451065381(5W 2G) 768451065404(5W 4G) 768451065398(12.8W 2G) 768451065411(12.8W 4G)